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AMD Poised to Launch New AI Chips, Intensifies Market Rivalry With Nvidia

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In a strategic move that underscores the intensifying competition in the artificial intelligence (AI) chip sector, Advanced Micro Devices (AMD) is set to unveil a new lineup of AI processors during an upcoming data center event in San Francisco. This announcement aims to strengthen AMD’s position as a formidable supplier of AI chips in a market that has been predominantly led by Nvidia. The event, scheduled for Thursday, is anticipated to feature details on AMD’s MI325X chip and the next-generation MI350 chip.

The MI350 series is designed to directly compete with Nvidia’s Blackwell architecture, promising enhanced computing power and memory capabilities. This development marks a significant effort by AMD to disrupt Nvidia’s market dominance in the AI chip landscape. AMD first introduced these chips at the Computex trade show in Taiwan in June, with plans for a release in the latter half of this year and into next year.

In addition to the AI chips, AMD is expected to unveil new server central processing units (CPUs) and PC chips that incorporate enhanced AI computing capabilities. This initiative illustrates AMD’s dedication to advancing AI technology and responding to the increasing demand for AI-driven solutions across various sectors.

AMD’s current MI300X AI chip, launched late last year, has experienced a swift uptick in production to meet growing market needs. In July, the company raised its AI chip revenue forecast for the year to $4.5 billion, up from a previous estimate of $4 billion, driven by substantial demand for the MI300X, especially in the realm of generative AI product development.

Market Competition

Despite AMD’s aggressive strategy, analysts suggest that its new product launches are unlikely to significantly impact Nvidia’s data center revenue, given that the demand for AI chips far outstrips supply. AMD is projected to report data center revenue of $12.83 billion this year, according to LSEG estimates, while Nvidia is expected to achieve a staggering $110.36 billion in the same segment. Data center revenue serves as a critical indicator of the demand for AI chips essential for developing and running AI applications.

The competitive landscape for AI chips has been evolving rapidly. Intel, another key player, recently announced its next-generation AI data center chips, the Gaudi 3 accelerator kit, which is priced around $125,000—substantially cheaper than Nvidia’s comparable HGX server system. Meanwhile, Nvidia continues to innovate with its next-generation AI platform, the Rubin platform, slated for release in 2026. This platform will succeed the Blackwell architecture, which has been highly sought after and is expected to remain sold out well into 2025 due to robust demand.

AMD’s Move Toward AI

AMD’s CEO, Lisa Su, has expressed a clear vision for the company’s future, emphasizing that AMD is not seeking to be a niche player in the AI chip market. This statement reflects the company’s ambition to solidify its presence as a major contender alongside established leaders like Nvidia and Intel.

As the AI chip market becomes increasingly competitive, AMD’s upcoming announcement is likely to further fuel this rivalry. With AI technology continuing to evolve and the demand for AI-powered solutions expanding, the market is poised for more innovations and strategic initiatives from industry giants. This dynamic landscape highlights the relentless pursuit of technological advancement in the AI chip arena.

Qualcomm Snapdragon 450 Platform Unveiled at Shanghai MWC 2017

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Soon future mobiles will sport Qualcomm Snapdragon 450 Mobile platform with a 14nm FinFET process for finger print scanningthat can penetrate glass and even metal, said the tech firm in a statement made at Mobile World Congress Shanghai 2017.

Qualcomm Technologies said its Snapdragon 400 Mobile Platform tier designed for mid-range smartphones and tablets, delivers significant improvements in battery life, graphics and computing performance, imaging and LTE connectivity over its predecessor, the Snapdragon 435 Mobile Platform.

Listing the four key features in its Snapdragon 450 platform, the company said it has higher performing octa-core ARM Cortex A53 CPU achieving 25 percent increase in compute performance compared to its predecessor. Additionally, the integrated Qualcomm Adreno 506 GPU delivers a 25 percent increase in graphics performance over the Snapdragon 435, it added.

Battery life will increase by up to four additional hours compared to the Snapdragon 435, as a 30 percent reduction in power is required when gaming, helping consumers stay connected and productive for much longer, said Snapdragon Technologies. The Snapdragon 450 sports Qualcomm Quick Charge 3.0 support, which can charge a typical smartphone from zero to 80 percent in about 35 minutes.

The Snapdragon 450 is a pioneer in the 400-tier to support real-time Bokeh (Live Bokeh) effects. It is also designed to improve on previous generations by including support for enhanced dual camera at 13+13MP, or single camera support up to 21MP; hybrid autofocus; and 1080p video capture and playback at up to 60fps, enabling slow motion capture. The Snapdragon 450 also includes support for 1920×1200 full HD displays, as well as the Qualcomm Hexagon DSP, which enables multimedia, camera and sensor processing at greater performance and lower power than the previous generation, claimed the company.

Connectivity and USB enable fast LTE connectivity with the Snapdragon X9 LTE modem, which utilizes 2x20MHz carrier aggregation in both downlink and uplink for peak speeds of 300 Mbps and 150 Mbps respectively, support for a large number of mobile networks with Snapdragon All Mode, and 802.11ac with MU-MIMO support. The Snapdragon 450 also supports USB 3.0 which is first in its tier to support fast USB data transfer, said the company.

“We’ve made many recent changes to the Snapdragon Mobile Platforms as part of our vision to deliver the most advanced mobile functionality at the best possible value, and the Snapdragon 450 Mobile Platform is another realization of that vision,” said Kedar Kondap, vice president, product management, Qualcomm Technologies. “With the Snapdragon 450, users are going to see a dramatically improved level of performance, connectivity, battery life and imaging performance.”

So far, more than 1900 designs have been either launched or are in the pipeline across the Snapdragon 400 tier mobile platforms, which is expected to begin commercial sampling to customers in Q3 2017, and is expected to be available in consumer devices by the end of 2017, said the company.